IBM BETS ON SAMSUNG IS MERGING TO MAKE NEW CHIP

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IBM BETS ON SAMSUNG IS MERGING TO MAKE NEW CHIP

When GlobalFoundries decides to stop the development and implementation of both lithography and ultra-violet lithography (EUV) lithography in the 7-nanometer node process in August, it looks like IBM, the second only to AMD as a client chip server for the most advanced fab in Malta, New York, will be left with its future power processor.

But that’s never happened anymore than with AMD, who switched from Globalfoundries to Taiwan Semiconductor Manufacturing Corp to future generations of “Rome” epic processors.

As we have seen, IBM does not go with TSMC, as most servers, networks, and ASIC chip makers are created in today’s data center arena, but prefer older research chips and Samsung development partners as wafer bakers.

We say at that time that you do not really need a computer learning conclusion from a supercomputer that works to think about it.

Big Blue stopped being himself four years ago when he paid Globalfoundries $ 1.5 billion to take IBM Microelectronics out of his hand. At that time, IBM also agreed with the former AMD founder to take over its branch in East Fishkill.

New York

to continue to make Power8 and Power8 chips based on 22 nanometer processes developed by IBM and submitted by GlobalFoundries. East Fishkill fish packaging is in the process of being exchanged from 45 nanometers of equipment and processes used to create Power7 chips from 2010 as well as from 32 nanometer processes used to make Power7 + in 2012.

(This way, it is a major sign there and it signifies a change in I / O and possibly a memory subsystem in the Power processor, it differs from a plus sign, which means a change in process or architecture or both in power chips, but also short major versions that have major changes.)

GlobalFoundries also takes over the manufacture of IBM’s primary processor system, which has several elements similar to the power chip lines but has different command and memory sets and I / O architecture from the Power line.

The power chip design plan we found in August 2015 and IBM spoke more about early 2018 called GlobalFoundries to make IBM’s future PowerPower processor, which had a good chance of being installed at least one and perhaps two exascale class supercomputer systems in the United States by 2021 to 2022.

Expected in 2015 is a Power10 chip will be made using 10 nanometer processes at Globalfoundries instead of 7 nanometer transistor gate geometries. Look at:

This action plan is not published when we write about it.

Earlier this year at the OpenPower Summit, IBM placed a roadmap that offers more insight into the key features of Power7 through Power10 as an indicator of how the processor architecture and system will change:

You will find that Power10 space only promises “new micro-architecture” and “new technology” and does not provide the right dimensions for the process used to create transistors.

It says no 10 nanometers or 7 nanometers

and we think it’s because IBM does not have high confidence in results with the 7-nanometer node process (although the Fabulous approach to Fab8’s two points in Malta has been used up to 7 nanometers in transit or otherwise) or other chip designers’ commitment to use Globalfoundries in both nodes of 10 nanometers, which were canceled in favor of all entries in 7 nanometers and some points in the past few years.

The original agreement between IBM and Globalfoundries is to run from 2014 to 2024 and out to a node of 10 nanometers. This is one of the reasons why Big Blue paid $ 1.5 billion to get IBM Microelectronics from its revenue stream and, with a $ 4.7 billion abolition in 2014 for his fabrics in Vermont and New York, from his books.

But the agreement is only made for five years, if you are considering the upcoming Power9 Processor renewal process in 2019 based on a 14 nanometer processor filtered from Globalfoundries. Power9 ‘is expected to have additional I / O and memory circuits, as Power8’ support continues to add NVLink support to Power8 design.

Part of the road map we see, IBM will double the core at Power10 48 one monolithic die using a 10-nanometer process sometimes between 2019 and 2020 and then moves to 7 nanometers to get more thrusts off with Power11 out more. The chip manufacturing nodes are increasingly difficult for every server chip maker, and it produces a catastrophe

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